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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 44775-2024 |
Integrated circuit three-dimensional packaging-chip stacking process and evaluation requirements {译} 集成电路三维封装-芯片叠层工艺过程和评价要求 |
China National Standards Integrated circuit three |
 English PDF |
| GB/T 44791-2024 |
Integrated circuit three-dimensional packaging-with Bump wafer thinning process and evaluation requirements {译} 集成电路三维封装-带凸点圆片减薄工艺过程和评价要求 |
China National Standards Integrated circuit three |
English PDF |
| GB/T 44796-2024 |
Integrated circuit three-dimensional packaging-Wafer dicing process and evaluation requirements with bumps {译} 集成电路三维封装-带凸点圆片划片工艺过程和评价要求 |
China National Standards Integrated circuit three |
English PDF |
| GB/T 43536.2-2023 |
Three-dimensional integrated circuits Part 2: Calibration requirements for fine-pitch stacked chips {译} 三维集成电路 第2部分：微间距叠层芯片的校准要求 |
China National Standards Integrated circuit three |
English PDF |
| GB/T 43536.1-2023 |
Three-dimensional integrated circuits Part 1: Terms and definitions {译} 三维集成电路 第1部分：术语和定义 |
China National Standards Integrated circuit three |
English PDF |
| GB/Z 43510-2023 |
Guide to Reliability Test Methods for Integrated Circuit TSV Three-Dimensional Packages {译} 集成电路TSV三维封装可靠性试验方法指南 |
China National Standards Integrated circuit three |
English PDF |
| GB/T 17024-1997 |
Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
China National Standards Integrated circuit three |
English PDF |
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