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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43226-2023 |
Single-event soft error time domain testing method for Semiconductor integrated circuits used in aerospace applications {译} 宇航用半导体集成电路单粒子软错误时域测试方法 |
China National Standards Semiconductor integrated circuits |
 English PDF |
| GB/T 43035-2023 |
Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements {译} 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 20870.5-2023 |
Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译} 半导体器件 第16-5部分：微波集成电路 振荡器 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 20870.2-2023 |
Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers {译} 半导体器件 第16-2部分：微波集成电路 预分频器 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 42848-2023 |
Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers {译} 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 7092-2021 |
Outline dimensions of Semiconductor integrated circuits 半导体集成电路外形尺寸 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 11498-2018 |
Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 13062-2018 |
Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 35007-2018 |
Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 35006-2018 |
Semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14028-2018 |
Semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 4377-2018 |
Semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 4023-2015 |
Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 16525-2015 |
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15878-2015 |
Semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15876-2015 |
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14112-2015 |
Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15877-2013 |
Semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 20870.1-2007 |
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17574.9-2006 |
Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17574.20-2006 |
Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17574.11-2006 |
Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 4589.1-2006 |
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 20515-2006 |
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 12750-2006 |
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for Semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 2900.66-2004 |
Electrotechnical terminology--Semiconductor devices and integrated circuits 电工术语 半导体器件和集成电路 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 19403.1-2003 |
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for Semiconductor integrated circuits(excluding hybrid circuits) 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17574.10-2003 |
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15651.3-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15651.2-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 18500.2-2001 |
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 18500.1-2001 |
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 5965-2000 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17940-2000 |
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 半导体器件 集成电路 第3部分:模拟集成电路 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 9424-1998 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17574-1998 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits 半导体器件 集成电路 第2部分:数字集成电路 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17573-1998 |
Semiconductor devices--Discrete devices and integrated circuits--Part 1:General 半导体器件 分立器件和集成电路 第1部分:总则 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17572-1998 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 4023-1997 |
Semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes 半导体器件 分立器件和集成电路 第2部分:整流二极管 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17024-1997 |
Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 17023-1997 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 6798-1996 |
Semiconductor integrated circuits--General principles of measuring methods of voltage comparators 半导体集成电路 电压比较器测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 4377-1996 |
Semiconductor integrated circuits--General principles of measuring methods of voltage regulator 半导体集成电路 电压调整器测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 3436-1996 |
Semiconductor integrated circuits--Series and products of operational amplifier 半导体集成电路 运算放大器系列和品种 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 16464-1996 |
Semiconductor devices--Integrated circuits--Part 1:General 半导体器件 集成电路 第1部分:总则 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15879-1995 |
Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15651-1995 |
Semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices 半导体器件 分立器件和集成电路 第5部分:光电子器件 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 4587-1994 |
Semiconductor discrete devices and integrated circuits--Part 7:Bipolar transistors 半导体分立器件和集成电路 第7部分:双极型晶体管 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 15136-1994 |
General principles of measuring methods for quartz clock and watch circuits of Semiconductor integrated circuits 半导体集成电路石英钟表电路测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14862-1993 |
Junction-to-case thermal resistance test methods of packages for Semiconductor integrated circuits 半导体集成电路封装结到外壳热阻测试方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14129-1993 |
Series and productsfor TTL Semiconductor integrated circuits--Products of series PAL 半导体集成电路TTL电路系列和品种 PAL系列的品种 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 7092-1993 |
Outline dimensions of semiconductor integratedcircuits 半导体集成电路外形尺寸 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14115-1993 |
General principles of measuring methods of Sample/Hold amplifiers for Semiconductor integrated circuits 半导体集成电路采样/保持放大器测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14114-1993 |
General principles of measuring methods of V/F and F/V converters for Semiconductor integrated circuits 半导体集成电路电压/频率和频率/电压转换器测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14032-1992 |
General principles of measuring methods of digital phase-locked loop for Semiconductor integrated circuits 半导体集成电路数字锁相环测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14031-1992 |
General principles of measuring methods of analogue phase-loop for Semiconductor integrated circuits 半导体集成电路模拟锁相环测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14030-1992 |
General principles of measuring methods of timer circuits for Semiconductor integrated circuits 半导体集成电路时基电路测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14029-1992 |
General principles of measuring methods of analogue multiplier for Semiconductor integrated circuits 半导体集成电路模拟乘法器测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 14028-1992 |
General principles of measuring methods of analogue switches for Semiconductor integrated circuits 半导体集成电路模拟开关测试方法的基本原理 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 3430-1989 |
The rule of type designation for Semiconductor integrated circuits 半导体集成电路型号命名方法 |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 7509-1987 |
Blank detail specification for microprocessor Semiconductor integrated circuits 半导体集成电路微处理器空白详细规范 (可供认证用) |
China National Standards Semiconductor integrated circuits |
English PDF |
| GB/T 3431.2-1986 |
Letter symbols for Semiconductor integrated circuits--Letter symbols for function of pins 半导体集成电路文字符号 引出端功能符号 |
China National Standards Semiconductor integrated circuits |
English PDF |
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