Cart:
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43536.2-2023 |
Three-dimensional integrated circuits Part 2: Calibration requirements for fine-pitch stacked chips {译} 三维集成电路 第2部分：微间距叠层芯片的校准要求 |
China National Standards Three dimensional integrated |
 English PDF |
| GB/T 43536.1-2023 |
Three-dimensional integrated circuits Part 1: Terms and definitions {译} 三维集成电路 第1部分：术语和定义 |
China National Standards Three dimensional integrated |
English PDF |
| GB/Z 43510-2023 |
Guide to Reliability Test Methods for Integrated Circuit TSV Three-Dimensional Packages {译} 集成电路TSV三维封装可靠性试验方法指南 |
China National Standards Three dimensional integrated |
English PDF |
| Find out:3Items | To Page of: First -Previous-Next -Last | 1 |
+86-755-25831330
