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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 35004-2018 |
Logic digital integrated circuits—Specification for I/O interface model for integrated circuit 数字集成电路 输入/输出电气接口模型规范 |
China National Standards circuits—Specification |
 English PDF |
| GB/T 16525-2015 |
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards circuits—Specification |
English PDF |
| GB/T 15878-2015 |
Semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards circuits—Specification |
English PDF |
| GB/T 15876-2015 |
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards circuits—Specification |
English PDF |
| GB/T 14112-2015 |
Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards circuits—Specification |
English PDF |
| GB/T 15877-2013 |
Semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards circuits—Specification |
English PDF |
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