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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| YS/T 1555-2022 |
Platinum cobalt chromium boron alloy sputtering target {译} 铂钴铬硼合金溅射靶材 |
China Non-ferrous Metal Industry
Standards sputtering |
 English PDF |
| YS/T 1358-2020 |
Iron Cobalt Tantalum Alloy sputtering Target for Magnetic Recording {译} 磁记录用铁钴钽合金溅射靶材 |
China Non-ferrous Metal Industry
Standards sputtering |
English PDF |
| YS/T 1357-2020 |
Chromium-tantalum-titanium alloy sputtering targets for magnetic recording {译} 磁记录用铬钽钛合金溅射靶材 |
China Non-ferrous Metal Industry
Standards sputtering |
English PDF |
| SJ/T 10754-2015 |
(Electronics with gold, silver and alloy brazing methods cleanliness, sputtering Determination) 电子器件用金、银及其合金钎料分析方法 清洁性、溅散性的测定 |
China Electronics
Standards sputtering |
English PDF |
| SJ/T 10478-1994 |
General specification for magnetic sputtering equipment 磁控溅射设备通用技术条件 |
China Electronics
Standards sputtering |
English PDF |
| SJ/T 31273-1994 |
Requirements of readiness and methods of inspection and assessment for EVP-13480 magnetron sputtering machines evp－13480型磁控溅射机完好要求和检查评定方法 |
China Electronics
Standards sputtering |
English PDF |
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