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 China "GB/T 35010.3-2018" standard english version information:

1. China GB/T 35010.3-2018 Standard Chinese version, you can purchase directly online; After receive your payment, we will send the GB Standards PDF file to your Email within 24 Hr.
2. China GB/T 35010.3-2018 Standard English version is not ready-made,only after get your order, then we translate them, time usually need 3-5 days. Detail refere: "How to purchase the English version China GB Standards?"
Item Content
GB Standard  Code GB/T 35010.3-2018
GB Standard Class China National Standard
GB Standard English Title Semiconductor die products—Part 3: Guide for handling, packing and storage
GB Standard Chinese Title 半导体芯片产品 第3部分:操作、包装和贮存指南
Applicable Category China National-
Chinese Version Price $15 USD per 50 pages
English Translation Price About $15  per 1 page; Detail enquire us for
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China "GB/T 35010.3-2018" Standard english version Add to Cart
Note The GB/T 35010.3-2018 standard english translation Prepayment unit $100 USD, is not mean this GB/T 35010.3-2018 standard english version price is $100 USD, it is only a basic unit of prepayment for translation, The actual translation fee and prepayment are depend on the amount of GB/T 35010.3-2018 standard Chinese words, We request 80% prepayment of the total translation fee.
For example, if the GB standard english price is $500, you need pay $400 prepayment, Four Quantities of the $100 prepayment unit.
  •  Relational standard of GB/T 35010.3-2018;    
  • Standard  Code GB Standard Title
  • GB/T 35010.8-2018
  • Semiconductor die products—Part8: EXPRESS model schema for data exchange
  • GB/T 35010.7-2018
  • Semiconductor die products—Part 7: XML schema for data exchange
  • GB/T 35010.1-2018
  • Semiconductor die products—Part 1:Requirements for procurement and use
  • GB/T 35010.3-2018
  • Semiconductor die products—Part 3: Guide for handling, packing and storage
  • GB/T 35010.4-2018
  • Semiconductor die products—Part 4: Requirements for die users and suppliers
  • GB/T 35010.2-2018
  • Semiconductor die products—Part 2: Exchange data formats
  • GB/T 35010.6-2018
  • Semiconductor die products—Part 6: Requirements for concerning thermal simulation
  • GB/T 35010.5-2018
  • Semiconductor die products—Part 5:Requirements for concerning electrical simulation
     
     

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