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 China "SJ 50597/33-1995" standard english version information:

1. China SJ 50597/33-1995 Standard Chinese version, you can purchase directly online; After receive your payment, we will send the GB Standards PDF file to your Email within 24 Hr.
2. China SJ 50597/33-1995 Standard English version is not ready-made,only after get your order, then we translate them, time usually need 3-5 days. Detail refere: "How to purchase the English version China GB Standards?"
Item Content
GB Standard  Code SJ 50597/33-1995
GB Standard Class China Electronics Standard
GB Standard English Title Semiconductor integrated circuits. Detail specification for Type JB200 CMOS dual SPST analog switch
GB Standard Chinese Title 半导体集成电路 jb200型cmos双路单刀单掷模拟开关详细规范
Applicable Category China Electronics-Electronics
Chinese Version Price $15 USD per 50 pages
English Translation Price About $15  per 1 page; Detail enquire us for
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Note The SJ 50597/33-1995 standard english translation Prepayment unit $100 USD, is not mean this SJ 50597/33-1995 standard english version price is $100 USD, it is only a basic unit of prepayment for translation, The actual translation fee and prepayment are depend on the amount of SJ 50597/33-1995 standard Chinese words, We request 80% prepayment of the total translation fee.
For example, if the GB standard english price is $500, you need pay $400 prepayment, Four Quantities of the $100 prepayment unit.
  •  Relational standard of SJ 50597/33-1995;    
  • Standard  Code GB Standard Title
  • GB/T 4377-2018
  • Semiconductor integrated circuits—Measuring method of voltage regulators
  • GB/T 14028-2018
  • Semiconductor integrated circuits—Measuring method of analogue switch
  • GB/T 35006-2018
  • Semiconductor integrated circuits—Measuring method of level converter
  • GB/T 35007-2018
  • Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
  • GB/T 4023-2015
  • Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes
  • GB/T 15878-2015
  • Semiconductor integrated circuits—Specification of leadframes for small outline package
  • GB/T 15876-2015
  • Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package
  • GB/T 14112-2015
  • Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
  • GB/T 16525-2015
  • Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
  • GB/T 15877-2013
  • Semiconductor integrated circuits—Specification of DIP leadframes produced by etching
     
     

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