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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 4937.21-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分：可焊性 |
China National Standards semi |
 English PDF |
| GB/T 4937.14-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） 半导体器件 机械和气候试验方法 第14部分：引出端强度（引线牢固性） |
China National Standards semi |
English PDF |
| GB/T 4937.201-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards semi |
English PDF |
| GB/T 4937.13-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件 机械和气候试验方法 第13部分：盐雾 |
China National Standards semi |
English PDF |
| GB/T 4937.20-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards semi |
English PDF |
| GB/T 4937.15-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热 |
China National Standards semi |
English PDF |
| GB/T 4937.12-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件 机械和气候试验方法 第12部分：扫频振动 |
China National Standards semi |
English PDF |
| GB/T 4937.18-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件 机械和气候试验方法 第18部分：电离辐照(总剂量) |
China National Standards semi |
English PDF |
| GB/T 4937.19-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件 机械和气候试验方法 第19部分：芯片剪切强度 |
China National Standards semi |
English PDF |
| GB/T 4937.30-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理 |
China National Standards semi |
English PDF |
| GB/T 36646-2018 |
Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy 制备氮化物半导体材料用氢化物气相外延设备 |
China National Standards semi |
English PDF |
| GB/T 4937.17-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件 机械和气候试验方法 第17部分：中子辐照 |
China National Standards semi |
English PDF |
| GB/T 4937.11-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法 |
China National Standards semi |
English PDF |
| GB/T 35989.1-2018 |
Petroleum and natural gas industries—Floating offshore structures—Part 1: Monohulls, semi-submersibles and spars 石油天然气工业 海上浮式结构 第1部分：单体船、半潜式平台和深吃水立柱式平台 |
China National Standards semi |
English PDF |
| GB/T 35897-2018 |
Pyropia yezoensis—Technical protocols for semi-floating raft cultivation 条斑紫菜 半浮动筏式栽培技术规范 |
China National Standards semi |
English PDF |
| GB/T 36005-2018 |
Measuring methods of optical radiation safety for semiconductor lighting equipments and systems 半导体照明设备和系统的光辐射安全测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.2-2018 |
semiconductor die products—Part 2: Exchange data formats 半导体芯片产品 第2部分：数据交换格式 |
China National Standards semi |
English PDF |
| GB/T 35010.6-2018 |
semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分：热仿真要求 |
China National Standards semi |
English PDF |
| GB/T 35010.8-2018 |
semiconductor die products—Part8: EXPRESS model schema for data exchange 半导体芯片产品 第8部分：数据交换的EXPRESS格式 |
China National Standards semi |
English PDF |
| GB/T 35007-2018 |
semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards semi |
English PDF |
| GB/T 35006-2018 |
semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.5-2018 |
semiconductor die products—Part 5：Requirements for concerning electrical simulation 半导体芯片产品 第5部分：电学仿真要求 |
China National Standards semi |
English PDF |
| GB/T 35010.7-2018 |
semiconductor die products—Part 7: XML schema for data exchange 半导体芯片产品 第7部分：数据交换的XML格式 |
China National Standards semi |
English PDF |
| GB/T 35010.1-2018 |
semiconductor die products—Part 1：Requirements for procurement and use 半导体芯片产品 第1部分：采购和使用要求 |
China National Standards semi |
English PDF |
| GB/T 14028-2018 |
semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.3-2018 |
semiconductor die products—Part 3: Guide for handling, packing and storage 半导体芯片产品 第3部分：操作、包装和贮存指南 |
China National Standards semi |
English PDF |
| GB/T 4377-2018 |
semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.4-2018 |
semiconductor die products—Part 4: Requirements for die users and suppliers 半导体芯片产品 第4部分：芯片使用者和供应商要求 |
China National Standards semi |
English PDF |
| GB/T 34971-2017 |
Guide for gaseous effluent handling in semiconductor industry 半导体制造用气体处理指南 |
China National Standards semi |
English PDF |
| GB/T 34507-2017 |
Palladium coated copper bonding wire for semiconductor package 封装键合用镀钯铜丝 |
China National Standards semi |
English PDF |
| GB/T 5226.33-2017 |
Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment 机械电气安全 机械电气设备 第33部分：半导体设备技术条件 |
China National Standards semi |
English PDF |
| GB/T 34383-2017 |
semi-straight side press 半闭式压力机 |
China National Standards semi |
English PDF |
| GB/T 34502-2017 |
Gold-coated silver and silver alloy bonding wires for semiconductor package 封装键合用镀金银及银合金丝 |
China National Standards semi |
English PDF |
| GB/T 33862-2017 |
Automatic（semi）Kjeldahl analyzer 全(半)自动凯氏定氮仪 |
China National Standards semi |
English PDF |
| GB/T 15651.4-2017 |
semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers 半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器 |
China National Standards semi |
English PDF |
| GB/T 33709-2017 |
Mobile laboratory—Guidance on dissemination and traceability of the value of equipment 移动实验室 仪器设备量值溯源与传递指南 |
China National Standards semi |
English PDF |
| GB/T 249-2017 |
The rule of type designation for discrete semiconductor devices 半导体分立器件型号命名方法 |
China National Standards semi |
English PDF |
| GB/T 14048.12-2016 |
Low-voltage switchgear and controlgear—Part 4-3: Contactors and motor-starters—AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分：接触器和电动机起动器 非电动机负载用交流半导体控制器和接触器 |
China National Standards semi |
English PDF |
| GB/T 32973-2016 |
Technical specification for hot charging and hot delivery of semi-closed arc furnace 半封闭矿热炉炉料热装热送技术规范 |
China National Standards semi |
English PDF |
| GB/T 32817-2016 |
semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 半导体器件 微机电器件 MEMS总规范 |
China National Standards semi |
English PDF |
| GB/T 14048.6-2016 |
Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器) |
China National Standards semi |
English PDF |
| GB/T 13539.4-2016 |
Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semi |
English PDF |
| GB/T 4023-2015 |
semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards semi |
English PDF |
| GB/T 15291-2015 |
semiconductor devices—Part 6: Thyristors 半导体器件 第6部分：晶闸管 |
China National Standards semi |
English PDF |
| GB/T 19199-2015 |
Test method for carbon acceptor concentration in semi-insulating gallium arsenide single crystals by infrared absorption spectroscopy 半绝缘砷化镓单晶中碳浓度的红外吸收测试方法 |
China National Standards semi |
English PDF |
| GB/T 17170-2015 |
Test method for the EL2 deep donor concentration in semi-insulating gallium arsenide single crystals by infrared absorption spectroscopy 半绝缘砷化镓单晶深施主EL2浓度红外吸收测试方法 |
China National Standards semi |
English PDF |
| GB/T 4085-2015 |
semirigid polyvinyl chloride floor tiles 半硬质聚氯乙烯块状地板 |
China National Standards semi |
English PDF |
| GB/T 31469-2015 |
semiconductor materials cutting fluid 半导体材料切削液 |
China National Standards semi |
English PDF |
| GB/T 16525-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 15878-2015 |
semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 15876-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 14112-2015 |
semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 31359-2015 |
Test methods of semiconductor lasers 半导体激光器测试方法 |
China National Standards semi |
English PDF |
| GB/T 31358-2015 |
General specification for semiconductor lasers 半导体激光器总规范 |
China National Standards semi |
English PDF |
| GB/T 8750-2014 |
Gold bonding wire for semiconductor package 半导体封装用键合金丝 |
China National Standards semi |
English PDF |
| GB/T 17951.2-2014 |
Cold-rolled non-oriented electrical steel strip delivered in the semi-processed state 半工艺冷轧无取向电工钢带 |
China National Standards semi |
English PDF |
| GB/T 15877-2013 |
semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards semi |
English PDF |
| GB 4793.9-2013 |
Safety requirements for electrical equipment for measurement, control and laboratory use―Part 9: Particular requirements for automatic and semi-automatic laboratory equipment for analysis and other purposes 测量、控制和实验室用电气设备的安全要求 第9部分：实验室用分析和其他目的自动和半自动设备的特殊要求 |
China National Standards semi |
English PDF |
| GB/T 17738.4-2013 |
Radio frequency and coaxial cable assemblies－Part 4: Sectional specification for semi-rigid coaxial cable assemblies 射频同轴电缆组件 第4部分：半硬同轴电缆组件分规范 |
China National Standards semi |
English PDF |
| GB/T 17738.3-2013 |
Radio frequency and coaxial cable assemblies―Part 3：Sectional specification for semi-flexible coaxial cable assemiblies 射频同轴电缆组件 第3部分：半柔同轴电缆组件分规范 |
China National Standards semi |
English PDF |
| GB/T 15872-2013 |
Power supply interface for semiconductor equipment 半导体设备电源接口 |
China National Standards semi |
English PDF |
| GB/T 30116-2013 |
Requirements for semiconductor manufacturing facility electromagnetic compatibility 半导体生产设施电磁兼容性要求 |
China National Standards semi |
English PDF |
| GB/T 29856-2013 |
Characterization of semiconducting single-walled carbon nanotubes using near infrared photoluminescence spectroscopy 半导体性单壁碳纳米管的近红外光致发光光谱表征方法 |
China National Standards semi |
English PDF |
| GB/T 29845-2013 |
Guide for final assembly, packaging,transportation, unpacking, and relocation of semiconductor manufacturing equipment 半导体制造设备的最终装配、包装、运输、拆包及安放导则 |
China National Standards semi |
English PDF |
| GB 50874-2013 |
Code for structure design on semi-underground storage bin in coal industry 煤炭工业半地下储仓建筑结构设计规范 |
China National Standards semi |
English PDF |
| GB/T 3859.3-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-3: Transformers and reactors 半导体变流器 通用要求和电网换相变流器 第1-3部分：变压器和电抗器 |
China National Standards semi |
English PDF |
| GB/T 3859.2-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide 半导体变流器 通用要求和电网换相变流器 第1-2部分：应用导则 |
China National Standards semi |
English PDF |
| GB/T 3859.1-2013 |
semiconductor converters - General requirements and line commutated Converters - Part 1-1: Specification of basic requirements 半导体变流器 通用要求和电网换相变流器 第1-1部分：基本要求规范 |
China National Standards semi |
English PDF |
| GB/T 13422-2013 |
semiconductor converters - Electrical test methods 半导体变流器 电气试验方法 |
China National Standards semi |
English PDF |
| GB/T 29332-2012 |
semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors(IGBT) 半导体器件 分立器件 第9部分：绝缘栅双极晶体管(IGBT) |
China National Standards semi |
English PDF |
| GB/T 29299-2012 |
General specification of semiconductor laser rangefinder 半导体激光测距仪通用技术条件 |
China National Standards semi |
English PDF |
| GB/T 13973-2012 |
General specification test methods for semiconductor device curve tracers 半导体管特性图示仪通用规范 |
China National Standards semi |
English PDF |
| GB/T 11436-2012 |
Chemical analysis methods for products and semi-finished products made of soft ferrite materials 软磁铁氧体材料成品、半成品化学分析方法 |
China National Standards semi |
English PDF |
| GB/T 4937.4-2012 |
semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件 机械和气候试验方法 第4部分：强加速稳态湿热试验（HAST） |
China National Standards semi |
English PDF |
| GB/T 4937.3-2012 |
semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件 机械和气候试验方法 第3部分：外部目检 |
China National Standards semi |
English PDF |
| GB 50800-2012 |
Technical code for anechoic and semi-anechoic rooms 消声室和半消声室技术规范 |
China National Standards semi |
English PDF |
| GB/T 5201-2012 |
Test procedures for semiconductor charged particle detectors 带电粒子半导体探测器测量方法 |
China National Standards semi |
English PDF |
| GB/T 12669-2012 |
General specification for cascade speed control assembly with semiconductor converter 半导体变流串级调速装置总技术条件 |
China National Standards semi |
English PDF |
| GB/T 12667-2012 |
General specification for excitation assembly with semiconductors for synchronous motors 同步电动机半导体励磁装置总技术条件 |
China National Standards semi |
English PDF |
| GB/Z 28586-2012 |
Geographic information - Web-based data dissemination specification 地理信息 基于网络的数据分发规范 |
China National Standards semi |
English PDF |
| GB 27995.2-2011 |
semi-finished spectacle lens blanks - Part 2: Specifications for progressive power lens blanks 半成品眼镜片毛坯 第2部分：渐变焦眼镜片毛坯规范 |
China National Standards semi |
English PDF |
| GB 27995.1-2011 |
semi-finished spectacle lens blanks - Part 1: Specifications for single-vision and multifocal lens blanks 半成品眼镜片毛坯 第1部分：单光和多焦点眼镜片毛坯规范 |
China National Standards semi |
English PDF |
| GB/T 19229.2-2011 |
Coal-fired flue gas desulphurization equipment - Part 2: Coal-fired dry/semi-dry flue gas desulphurization equipment 燃煤烟气脱硫设备 第2部分：燃煤烟气干法/半干法脱硫设备 |
China National Standards semi |
English PDF |
| GB/T 27524-2011 |
Cigarettes - Determination of semi-volatile compounds (pyridine, styrene, quinoline) in mainstream smoke - GC-MS method 卷烟 主流烟气中半挥发性物质(吡啶、苯乙烯、喹啉)的测定 气相色谱-质谱联用法 |
China National Standards semi |
English PDF |
| GB/T 26960-2011 |
semi automatic strapping machine 半自动捆扎机 |
China National Standards semi |
English PDF |
| GB/T 26777-2011 |
semitrailer landing gears 挂车支撑装置 |
China National Standards semi |
English PDF |
| GB/T 26070-2010 |
Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
China National Standards semi |
English PDF |
| GB/T 254-2010 |
semi-refined paraffin wax 半精炼石蜡 |
China National Standards semi |
English PDF |
| GB/T 6616-2009 |
Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge 半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法 |
China National Standards semi |
English PDF |
| GB/T 1555-2009 |
Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 |
China National Standards semi |
English PDF |
| GB/T 14264-2009 |
semiconductor materials-terms and definitions 半导体材料术语 |
China National Standards semi |
English PDF |
| GB/T 14140-2009 |
Test method for measuring diameter of semiconductor wafer 硅片直径测量方法 |
China National Standards semi |
English PDF |
| GB/T 24468-2009 |
Specification for definition and measurement of semiconductor equipment reliability, availability, and maintainability(RAM) 半导体设备可靠性、可用性和维修性（RAM）的定义和测量规范 |
China National Standards semi |
English PDF |
| GB/T 22863-2009 |
semi-worsted fabric 半精纺毛织品 |
China National Standards semi |
English PDF |
| GB/T 13539.4-2009 |
Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semi |
English PDF |
| GB/T 23336-2009 |
General technical requirements for semitrailer 半挂车通用技术条件 |
China National Standards semi |
English PDF |
| GB 14536.5-2008 |
Automatic electrical controls for household and similar use - Particular requirements for thermal motor protectors for motor-compressors of hermetic and semi-hermetic type 家用和类似用途电自动控制器 密封和半密封电动机-压缩机用电动机热保护器的特殊要求 |
China National Standards semi |
English PDF |
| GB/T 22649-2008 |
Aluminium and aluminium alloys foil for semi-rigid container 半刚性容器用铝及铝合金箔 |
China National Standards semi |
English PDF |
| GB/T 8381-2008 |
Determination of aflatoxin B1 in animal feeding stuffs - semi-quantitative thin layer chromatographic methods 饲料中黄曲霉毒素B1的测定 半定量薄层色谱法 |
China National Standards semi |
English PDF |
| GB/T 16582-2008 |
Plastics - Determination of melting behaviour (melting temperature or melting range) of semi-crystalline polymers by capillary tube and polarizing-microscope methods 塑料 用毛细管法和偏光显微镜法测定部分结晶聚合物熔融行为（熔融温度或熔融范围） |
China National Standards semi |
English PDF |
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