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GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards; We provide Chinese GB standards and English version GB standards Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services. |
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 22193-2008 |
Electrical installations in ships - Equipment - semiconductor convertors 船舶电气设备 设备 半导体变流器 |
China National Standards semi |
 English PDF |
| GB/T 12972.3-2008 |
Flexible rubber-sheathed cables for mining purposes - Part 3：Trailing coalcutter cables with monitoring core and semiconducting screens for rated voltage of 0.66/1.14kV 矿用橡套软电缆 第3部分: 额定电压0.66/1.14kV 采煤机屏蔽监视加强型软电缆 |
China National Standards semi |
English PDF |
| GB/T 21865-2008 |
Standard test methods for determining average grain size using semiautomatic and automatic image analysis 用半自动和自动图象分析法测量平均粒度的标准测试方法 |
China National Standards semi |
English PDF |
| GB/T 21858-2008 |
Testing of chemicals - Bioconcentration - semi-static fish test 化学品 生物富集 半静态式鱼类试验 |
China National Standards semi |
English PDF |
| GB/T 21548-2008 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards semi |
English PDF |
| GB 14048.6-2008 |
Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters AC semiconductor motor controllers and starters(including soft-starter) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流半导体电动机控制器和起动器（含软起动器） |
China National Standards semi |
English PDF |
| GB/T 8928-2008 |
Standard test method for density of semi-solid and solid asphalt 固体和半固体石油沥青密度测定法 |
China National Standards semi |
English PDF |
| GB/T 7971-2007 |
semiconducting electric cable paper 半导电电缆纸 |
China National Standards semi |
English PDF |
| GB/T 21226-2007 |
semiconductor convertors - Identification code for convertor connections 半导体变流器 变流联结的标识代号 |
China National Standards semi |
English PDF |
| GB/T 3048.3-2007 |
Test methods for electrical properties of electric cables and wires - Part 3：Test of volume resistivity of semi-conducting rubbers and plastics 电线电缆电性能试验方法 第3部分：半导电橡塑材料体积电阻率试验 |
China National Standards semi |
English PDF |
| GB/T 21160-2007 |
Agricultural trailers - Balanced and semi-mounted trailers - Determination of payload, vertical static load and axle load 农用挂车 全挂车和半挂车有效载荷、垂直静态载荷和轴载荷的测定 |
China National Standards semi |
English PDF |
| GB/T 21039.1-2007 |
semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification 半导体器件 分立器件 第4-1部分：微波二极管和晶体管 微波场效应晶体管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 20911-2007 |
semi finished products for forging - Tolerances on dimensions shape and mass 锻造用半成品尺寸、形状和质量公差 |
China National Standards semi |
English PDF |
| GB/T 20870.1-2007 |
semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 |
China National Standards semi |
English PDF |
| GB/T 20726-2006 |
Instrumental specification for energy dispersive X-ray spectrometers with semiconductor detectors 半导体探测器X射线能谱仪通则 |
China National Standards semi |
English PDF |
| GB/T 17574.9-2006 |
semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 17574.20-2006 |
semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 |
China National Standards semi |
English PDF |
| GB/T 17574.11-2006 |
semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 14048.12-2006 |
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters-AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分：接触器和电动机起动器-非电动机负载用交流半导体控制器和接触器 |
China National Standards semi |
English PDF |
| GB/T 10236-2006 |
Guide for compatibility and protection of interference effects between semiconductor convertors and power supply system 半导体变流器与供电系统的兼容及干扰防护导则 |
China National Standards semi |
English PDF |
| GB/T 4589.1-2006 |
semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 |
China National Standards semi |
English PDF |
| GB/T 20516-2006 |
semiconductor devices - Discrete devices - Part 4: Microwave devices 半导体器件 分立器件 第4部分：微波器件 |
China National Standards semi |
English PDF |
| GB/T 20515-2006 |
semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 |
China National Standards semi |
English PDF |
| GB/T 4937.2-2006 |
semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure 半导体器件 机械和气候试验方法 第2部分:低气压 |
China National Standards semi |
English PDF |
| GB/T 4937.1-2006 |
semiconductor devices―Mechanical and climatic test methods―Part 1: General 半导体器件 机械和气候试验方法 第1部分: 总则 |
China National Standards semi |
English PDF |
| GB/T 20522-2006 |
semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors 半导体器件 第14-3部分: 半导体传感器-压力传感器 |
China National Standards semi |
English PDF |
| GB/T 20521-2006 |
Semconductor devices Part 14-1: semiconductor sensors - General and classification 半导体器件 第14-1部分: 半导体传感器-总则和分类 |
China National Standards semi |
English PDF |
| GB/T 12750-2006 |
semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) |
China National Standards semi |
English PDF |
| GB/T 4326-2006 |
Extrinsic semiconductor single crystals measurement of Hall mobility and Hall coefficient 非本征半导体单晶霍尔迁移率和霍尔系数测量方法 |
China National Standards semi |
English PDF |
| GB/T 4607-2006 |
Road vehicles - 90 semi-trailer fifth wheel coupling pin - Basic and mounting/interchangeability dimensions 道路车辆 半挂车牵引座90号牵引销的基本尺寸和安装、互换性尺寸 |
China National Standards semi |
English PDF |
| GB/T 4606-2006 |
Road vehicles - 50 semi-trailer fifth wheel coupling pin - Basic and mounting/interchangeability dimensions 道路车辆 半挂车牵引座50号牵引销的基本尺寸和安装、互换性尺寸 |
China National Standards semi |
English PDF |
| GB/T 20070-2006 |
Road vehicles - Mechanical coupling between tractors and semi-trailers - Interchangeability 道路车辆 牵引车与半挂车之间机械连接互换性 |
China National Standards semi |
English PDF |
| GB/T 13151-2005 |
semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 第6部分:晶闸管 第3篇 电流大于 100A、环境和管壳额定的反向阻断三极晶闸管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 13150-2005 |
semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 电流大于 100A、环境和管壳额定的双向三极晶闸管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 4728.5-2005 |
Graphical symbols for diagrams Part 5 semiconductors and electron tubes 电气简图用图形符号 第5部分:半导体管和电子管 |
China National Standards semi |
English PDF |
| GB/T 4085-2005 |
semirigid polyvinyl chloride floor tiles 半硬质聚氯乙烯块状地板 |
China National Standards semi |
English PDF |
| GB/T 19629-2005 |
Medical Electrical Equipment-Dosimeters with ionization chambers and/or semi-conductors as used in X-ray diagnostic imaging 医用电气设备 X射线诊断影像中使用的电离室和(或)半导体探测器剂量计 |
China National Standards semi |
English PDF |
| GB/T 3859.4-2004 |
semiconductor converter--Self-commutated semiconductor converters including direct d.c.converters 半导体变流器 包括直接直流变流器的半导体自换相变流器 |
China National Standards semi |
English PDF |
| GB/T 2900.66-2004 |
Electrotechnical terminology--semiconductor devices and integrated circuits 电工术语 半导体器件和集成电路 |
China National Standards semi |
English PDF |
| GB/T 8446.3-2004 |
Heat sink for power semiconductor device--Part 3:Insulators and fasteners 电力半导体器件用散热器 第3部分:绝缘件和紧固件 |
China National Standards semi |
English PDF |
| GB/T 8446.2-2004 |
Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference 电力半导体器件用散热器 第2部分:热阻和流阻测试方法 |
China National Standards semi |
English PDF |
| GB/T 8446.1-2004 |
Heat sink for power semiconductor device--Part 1:Casting kind series 电力半导体器件用散热器 第1部分:铸造类系列 |
China National Standards semi |
English PDF |
| GB/T 19403.1-2003 |
semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) |
China National Standards semi |
English PDF |
| GB/T 17574.10-2003 |
semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 15651.3-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 |
China National Standards semi |
English PDF |
| GB/T 15651.2-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 |
China National Standards semi |
English PDF |
| GB/T 5009.160-2003 |
Determination of semiamitraz residues in fruits 水果中单甲脒残留量的测定 |
China National Standards semi |
English PDF |
| GB/T 11685-2003 |
Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energyspectrometers 半导体X射线探测器系统和半导体X射线能谱仪的测量方法 |
China National Standards semi |
English PDF |
| GB/T 19199-2003 |
Test method for carbon concentration of semi-insulating monocrystal gallium arsenide by measurement infrared absorption method 半绝缘砷化镓单晶中碳浓度的红外吸收测试方法 |
China National Standards semi |
English PDF |
| GB/T 18904.5-2003 |
semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems 半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 6589-2002 |
semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) 半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 18904.4-2002 |
semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems 半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 18904.3-2002 |
semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application 半导体器件 第12-3部分:光电子器件 显示用发光二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 18904.2-2002 |
semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems 半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 18904.1-2002 |
semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems 半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 18500.2-2001 |
semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 18500.1-2001 |
semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 11499-2001 |
Letter symbols for discrete semiconductor devices 半导体分立器件文字符号 |
China National Standards semi |
English PDF |
| GB/T 4588.12-2000 |
Specification for mass laminationpanels (semi-manufactured multilayer printed boards) 预制内层层压板规范(半制成多层印制板) |
China National Standards semi |
English PDF |
| GB/T 17737.2-2000 |
Radio-frequency cables--Part 2:Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene(PTFE) insulation 射频电缆 第2部分:聚四氟乙烯(PTFE)绝缘半硬射频同轴电缆分规范 |
China National Standards semi |
English PDF |
| GB/T 6588-2000 |
semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 17950-2000 |
semiconductor converter--Part 6:Application guide for the protection of semiconductor converters against overcurrent by fuses 半导体变流器 第6部分:使用熔断器保护半导体变流器防止过电流的应用导则 |
China National Standards semi |
English PDF |
| GB/T 5965-2000 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 17940-2000 |
semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 半导体器件 集成电路 第3部分:模拟集成电路 |
China National Standards semi |
English PDF |
| GB/T 12560-1999 |
semiconductor devices--Sectional specification for discrete devices 半导体器件 分立器件分规范 |
China National Standards semi |
English PDF |
| GB/T 9424-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 7576-1998 |
semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 6590-1998 |
semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs)，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 6352-1998 |
semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 6351-1998 |
semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes)，ambient and case-rated，up to 100A 半导体器件 分立器件 第2部分:整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 6219-1998 |
semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz 半导体器件 分立器件 第8部分:场效应晶体管 第一篇 1 GHz、5 W以下的单栅场效应晶体管 空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 6217-1998 |
semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section One:Blank detail speci-fication for ambient-rated bipolar transistors for low and high frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第一篇 高低频放大环境额定的双极型晶体管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 17574-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits 半导体器件 集成电路 第2部分:数字集成电路 |
China National Standards semi |
English PDF |
| GB/T 17573-1998 |
semiconductor devices--Discrete devices and integrated circuits--Part 1:General 半导体器件 分立器件和集成电路 第1部分:总则 |
China National Standards semi |
English PDF |
| GB/T 17572-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 |
China National Standards semi |
English PDF |
| GB/T 17170-1997 |
Test method for deep level EL2 concentration of undoped semiinsulating monocrystal gallium arsenide by measurement infra-red absorption method 非掺杂半绝缘砷化镓单晶深能级EL2浓度红外吸收测试方法 |
China National Standards semi |
English PDF |
| GB/T 4023-1997 |
semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes 半导体器件 分立器件和集成电路 第2部分:整流二极管 |
China National Standards semi |
English PDF |
| GB/T 17024-1997 |
semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 17023-1997 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 |
China National Standards semi |
English PDF |
| GB/T 1550-1997 |
Standard methods for measuring conductivity type of extrinsic semiconducting materials 非本征半导体材料导电类型测试方法 |
China National Standards semi |
English PDF |
| GB/T 6798-1996 |
semiconductor integrated circuits--General principles of measuring methods of voltage comparators 半导体集成电路 电压比较器测试方法的基本原理 |
China National Standards semi |
English PDF |
| GB/T 4377-1996 |
semiconductor integrated circuits--General principles of measuring methods of voltage regulator 半导体集成电路 电压调整器测试方法的基本原理 |
China National Standards semi |
English PDF |
| GB/T 3436-1996 |
semiconductor integrated circuits--Series and products of operational amplifier 半导体集成电路 运算放大器系列和品种 |
China National Standards semi |
English PDF |
| GB/T 16464-1996 |
semiconductor devices--Integrated circuits--Part 1:General 半导体器件 集成电路 第1部分:总则 |
China National Standards semi |
English PDF |
| GB/T 16438-1996 |
The safety demands of using semiconductor lightning eliminator 半导体少长针消雷装置使用的安全要求 |
China National Standards semi |
English PDF |
| GB/T 15879-1995 |
Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards semi |
English PDF |
| GB/T 15873-1995 |
Directives for drafting semiconductor facilities interface specification 半导体设施接口技术文件编写导则 |
China National Standards semi |
English PDF |
| GB/T 6571-1995 |
semiconductordevices--Discrete devices--Part 3:Signal(including switching)and regulator diodes 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 |
China National Standards semi |
English PDF |
| GB/T 15653-1995 |
Measuring methods for gas sensors of metal-oxide semiconductor 金属氧化物半导体气敏元件测试方法 |
China National Standards semi |
English PDF |
| GB/T 15652-1995 |
Generic specification for gas sensors of metal-oxide semiconductor 金属氧化物半导体气敏元件总规范 |
China National Standards semi |
English PDF |
| GB/T 15651-1995 |
semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices 半导体器件 分立器件和集成电路 第5部分:光电子器件 |
China National Standards semi |
English PDF |
| GB/T 15649-1995 |
Blank detail specification for semiconductor laser diodes 半导体激光二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 4587-1994 |
semiconductor discrete devices and integrated circuits--Part 7:Bipolar transistors 半导体分立器件和集成电路 第7部分:双极型晶体管 |
China National Standards semi |
English PDF |
| GB/T 4586-1994 |
semiconductor devices--Discrete devices--Part 8:Field-effect transistors 半导体器件 分立器件 第8部分:场效应晶体管 |
China National Standards semi |
English PDF |
| GB/T 15291-1994 |
semiconductor devices--Part 6:Thyristors 半导体器件 第6部分 晶闸管 |
China National Standards semi |
English PDF |
| GB/T 4376-1994 |
Series and products of voltage regulators for semi-conductor integrated circuits 半导体集成电路 电压调整器系列和品种 |
China National Standards semi |
English PDF |
| GB/T 15136-1994 |
General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits 半导体集成电路石英钟表电路测试方法的基本原理 |
China National Standards semi |
English PDF |
| GB/T 2900.32-1994 |
Electrotechnical terminology--Power semiconductor device 电工术语 电力半导体器件 |
China National Standards semi |
English PDF |
| GB/T 14862-1993 |
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits 半导体集成电路封装结到外壳热阻测试方法 |
China National Standards semi |
English PDF |
| GB/T 14844-1993 |
Designations of semiconductor materials 半导体材料牌号表示方法 |
China National Standards semi |
English PDF |
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