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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 8750-2022 |
Gold-based bonding wire and ribbon for semiconductor packaging {译} 半导体封装用金基键合丝、带 |
China National Standards Gold bonding wire |
 English PDF |
| GB/T 34502-2017 |
Gold-coated silver and silver alloy bonding wires for semiconductor package 封装键合用镀金银及银合金丝 |
China National Standards Gold bonding wire |
English PDF |
| GB/T 8750-2014 |
Gold bonding wire for semiconductor package 半导体封装用键合金丝 |
China National Standards Gold bonding wire |
English PDF |
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