China National Standards

China semiconductor GB Standards List


  •  China "semiconductor" GB Standards List:
  • Standard  Code Standard Title Standard Class Order
    GB/T 43493.3-2023 semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects {译}
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分:缺陷的光致发光检测方法
    China National Standards
    semiconductor

    English PDF
    GB/T 43493.2-2023 semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects {译}
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分:缺陷的光学检测方法
    China National Standards
    semiconductor

    English PDF
    GB/T 43493.1-2023 semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification {译}
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分:缺陷分类
    China National Standards
    semiconductor

    English PDF
    GB/T 43366-2023 General specification for semiconductor discrete devices for aerospace applications {译}
    宇航用半导体分立器件通用规范
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.26-2023 semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译}
    半导体器件 机械和气候试验方法 第26部分:静电放电(ESD)敏感度测试 人体模型(HBM)
    China National Standards
    semiconductor

    English PDF
    GB/T 4587-2023 semiconductor Devices Discrete Devices Part 7: Bipolar Transistors {译}
    半导体器件 分立器件 第7部分:双极型晶体管
    China National Standards
    semiconductor

    English PDF
    GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications {译}
    宇航用半导体集成电路单粒子软错误时域测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 43136-2023 Superabrasive products Grinding wheels for precision scribing of semiconductor chips {译}
    超硬磨料制品 半导体芯片精密划切用砂轮
    China National Standards
    semiconductor

    English PDF
    GB/T 43061-2023 semiconductor integrated circuit PWM controller test method {译}
    半导体集成电路 PWM控制器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 43040-2023 semiconductor integrated circuit AC/DC converter test method {译}
    半导体集成电路 AC/DC变换器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 43035-2023 semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements {译}
    半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范 第一篇:内部目检要求
    China National Standards
    semiconductor

    English PDF
    GB/T 42975-2023 semiconductor integrated circuit driver test methods {译}
    半导体集成电路 驱动器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 42974-2023 semiconductor integrated circuit flash memory (FLASH) {译}
    半导体集成电路 快闪存储器(FLASH)
    China National Standards
    semiconductor

    English PDF
    GB/T 42973-2023 semiconductor integrated circuit Digital-to-analog (DA) converter {译}
    半导体集成电路 数字模拟(DA)转换器
    China National Standards
    semiconductor

    English PDF
    GB/T 42970-2023 semiconductor integrated circuit video encoding and decoding circuit testing method {译}
    半导体集成电路 视频编解码电路测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 20870.5-2023 semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译}
    半导体器件 第16-5部分:微波集成电路 振荡器
    China National Standards
    semiconductor

    English PDF
    GB/T 20870.2-2023 semiconductor devices Part 16-2: Microwave integrated circuits Prescalers {译}
    半导体器件 第16-2部分:微波集成电路 预分频器
    China National Standards
    semiconductor

    English PDF
    GB/T 20870.10-2023 semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures {译}
    半导体器件 第16-10部分:单片微波集成电路技术可接收程序
    China National Standards
    semiconductor

    English PDF
    GB/T 15651.6-2023 semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes {译}
    半导体器件 第5-6部分:光电子器件 发光二极管
    China National Standards
    semiconductor

    English PDF
    GB/T 42709.19-2023 semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass {译}
    半导体器件 微电子机械器件 第19部分:电子罗盘
    China National Standards
    semiconductor

    English PDF
    GB/T 42676-2023 Testing the quality of semiconductor single crystals X-ray diffraction method {译}
    半导体单晶晶体质量的测试 X射线衍射法
    China National Standards
    semiconductor

    English PDF
    GB/T 6616-2023 Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method {译}
    半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法
    China National Standards
    semiconductor

    English PDF
    GB/T 1555-2023 semiconductor single crystal crystal orientation determination method {译}
    半导体单晶晶向测定方法
    China National Standards
    semiconductor

    English PDF
    GB/T 42848-2023 semiconductor integrated circuits - Test methods for direct digital frequency synthesizers {译}
    半导体集成电路 直接数字频率合成器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 42839-2023 semiconductor integrated circuit Analog-to-digital (AD) converter {译}
    半导体集成电路 模拟数字(AD)转换器
    China National Standards
    semiconductor

    English PDF
    GB/T 42838-2023 semiconductor integrated circuit Hall circuit test method {译}
    半导体集成电路 霍尔电路测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 42837-2023 Microwave semiconductor integrated circuit amplifier {译}
    微波半导体集成电路 放大器
    China National Standards
    semiconductor

    English PDF
    GB/T 42836-2023 Microwave semiconductor integrated circuit mixer {译}
    微波半导体集成电路 混频器
    China National Standards
    semiconductor

    English PDF
    GB/T 42835-2023 semiconductor integrated circuit system on chip (SoC) {译}
    半导体集成电路 片上系统(SoC)
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.23-2023 semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译}
    半导体器件 机械和气候试验方法 第23部分:高温工作寿命
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.27-2023 semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译}
    半导体器件 机械和气候试验方法 第27部分:静电放电(ESD)敏感度测试 机器模型(MM)
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.32-2023 semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译}
    半导体器件 机械和气候试验方法 第32部分:塑封器件的易燃性(外部引起的)
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.31-2023 semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译}
    半导体器件 机械和气候试验方法 第31部分:塑封器件的易燃性(内部引起的)
    China National Standards
    semiconductor

    English PDF
    GB/T 42706.5-2023 Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers {译}
    电子元器件 半导体器件长期贮存 第5部分:芯片和晶圆
    China National Standards
    semiconductor

    English PDF
    GB/T 42706.2-2023 Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms {译}
    电子元器件 半导体器件长期贮存 第2部分:退化机理
    China National Standards
    semiconductor

    English PDF
    GB/T 42706.1-2023 Electronic components - Long term storage of semiconductor devices - Part 1: General {译}
    电子元器件 半导体器件长期贮存 第1部分:总则
    China National Standards
    semiconductor

    English PDF
    GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译}
    半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.42-2023 semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译}
    半导体器件 机械和气候试验方法 第42部分:温湿度贮存
    China National Standards
    semiconductor

    English PDF
    GB/T 42709.7-2023 semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译}
    半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器
    China National Standards
    semiconductor

    English PDF
    GB/T 42709.5-2023 semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译}
    半导体器件 微电子机械器件 第5部分:射频MEMS开关
    China National Standards
    semiconductor

    English PDF
    GB/T 8446.3-2022 Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
    电力半导体器件用散热器  第3部分:绝缘件和紧固件
    China National Standards
    semiconductor

    English PDF
    GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
    电力半导体器件用散热器  第2部分:热阻和流阻测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
    电力半导体器件用散热器  第1部分:散热体
    China National Standards
    semiconductor

    English PDF
    GB/T 8750-2022 Gold-based bonding wire and ribbon for semiconductor packaging {译}
    半导体封装用金基键合丝、带
    China National Standards
    semiconductor

    English PDF
    GB/T 34590.11-2022 Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications {译}
    道路车辆 功能安全 第11部分:半导体应用指南
    China National Standards
    semiconductor

    English PDF
    GB/T 41852-2022 semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译}
    半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
    China National Standards
    semiconductor

    English PDF
    GB/T 41853-2022 semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement {译}
    半导体器件 微机电器件 晶圆间键合强度测量
    China National Standards
    semiconductor

    English PDF
    GB/T 21548-2021 Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems
    光通信用高速直接调制半导体激光器的测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
    半导体集成电路外形尺寸
    China National Standards
    semiconductor

    English PDF
    GB/T 41040-2021 COTS semiconductor parts for space application -- Quality assurance requirements
    宇航用商业现货(COTS)半导体器件 质量保证要求
    China National Standards
    semiconductor

    English PDF
    GB/T 38345-2019 General design requirements of semiconductor integrate circuit for space application
    宇航用半导体集成电路通用设计要求
    China National Standards
    semiconductor

    English PDF
    GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    半导体器件的机械标准化 第4部分:半导体器件封装外形的分类和编码体系
    China National Standards
    semiconductor

    English PDF
    GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    航空电子过程管理 航空航天、国防及其他高性能应用领域(ADHP)电子元器件 第1部分:高可靠集成电路与分立半导体器件通用要求
    China National Standards
    semiconductor

    English PDF
    GB/T 11498-2018 semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
    半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)
    China National Standards
    semiconductor

    English PDF
    GB/T 13062-2018 semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
    半导体器件-集成电路-第21-1部分:膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)
    China National Standards
    semiconductor

    English PDF
    GB/T 14844-2018 Designations of semiconductor materials
    半导体材料牌号表示方法
    China National Standards
    semiconductor

    English PDF
    GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
    纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 37031-2018 semiconductor lighting terminology
    半导体照明术语
    China National Standards
    semiconductor

    English PDF
    GB/T 36474-2018 semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)
    半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 36477-2018 semiconductor integrated circuit—Measuring methods for flash memory
    半导体集成电路 快闪存储器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 36360-2018 semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes
    半导体光电子器件 中功率发光二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 36358-2018 semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes
    半导体光电子器件 功率发光二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 36359-2018 semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes
    半导体光电子器件 小功率发光二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 4728.5-2018 Graphical symbols for electrical diagrams—Part 5:semiconductors and electron tubes
    电气简图用图形符号 第5部分:半导体管和电子管
    China National Standards
    semiconductor

    English PDF
    GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
    半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.22-2018 semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
    半导体器件 机械和气候试验方法 第22部分:键合强度
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.21-2018 semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
    半导体器件 机械和气候试验方法 第21部分:可焊性
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.14-2018 semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity)
    半导体器件 机械和气候试验方法 第14部分:引出端强度(引线牢固性)
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.201-2018 semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.13-2018 semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
    半导体器件 机械和气候试验方法 第13部分:盐雾
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.20-2018 semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.15-2018 semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
    半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.12-2018 semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
    半导体器件 机械和气候试验方法 第12部分:扫频振动
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.18-2018 semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
    半导体器件 机械和气候试验方法 第18部分:电离辐照(总剂量)
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.19-2018 semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
    半导体器件 机械和气候试验方法 第19部分:芯片剪切强度
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.30-2018 semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
    半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理
    China National Standards
    semiconductor

    English PDF
    GB/T 36646-2018 Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy
    制备氮化物半导体材料用氢化物气相外延设备
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.17-2018 semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
    半导体器件 机械和气候试验方法 第17部分:中子辐照
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.11-2018 semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
    半导体器件 机械和气候试验方法 第11部分:快速温度变化 双液槽法
    China National Standards
    semiconductor

    English PDF
    GB/T 36005-2018 Measuring methods of optical radiation safety for semiconductor lighting equipments and systems
    半导体照明设备和系统的光辐射安全测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.2-2018 semiconductor die products—Part 2: Exchange data formats
    半导体芯片产品 第2部分:数据交换格式
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.6-2018 semiconductor die products—Part 6: Requirements for concerning thermal simulation
    半导体芯片产品 第6部分:热仿真要求
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.8-2018 semiconductor die products—Part8: EXPRESS model schema for data exchange
    半导体芯片产品 第8部分:数据交换的EXPRESS格式
    China National Standards
    semiconductor

    English PDF
    GB/T 35007-2018 semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
    半导体集成电路 低电压差分信号电路测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 35006-2018 semiconductor integrated circuits—Measuring method of level converter
    半导体集成电路 电平转换器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.5-2018 semiconductor die products—Part 5:Requirements for concerning electrical simulation
    半导体芯片产品 第5部分:电学仿真要求
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.7-2018 semiconductor die products—Part 7: XML schema for data exchange
    半导体芯片产品 第7部分:数据交换的XML格式
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.1-2018 semiconductor die products—Part 1:Requirements for procurement and use
    半导体芯片产品 第1部分:采购和使用要求
    China National Standards
    semiconductor

    English PDF
    GB/T 14028-2018 semiconductor integrated circuits—Measuring method of analogue switch
    半导体集成电路 模拟开关测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.3-2018 semiconductor die products—Part 3: Guide for handling, packing and storage
    半导体芯片产品 第3部分:操作、包装和贮存指南
    China National Standards
    semiconductor

    English PDF
    GB/T 4377-2018 semiconductor integrated circuits—Measuring method of voltage regulators
    半导体集成电路 电压调整器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 35010.4-2018 semiconductor die products—Part 4: Requirements for die users and suppliers
    半导体芯片产品 第4部分:芯片使用者和供应商要求
    China National Standards
    semiconductor

    English PDF
    GB/T 34971-2017 Guide for gaseous effluent handling in semiconductor industry
    半导体制造用气体处理指南
    China National Standards
    semiconductor

    English PDF
    GB/T 34507-2017 Palladium coated copper bonding wire for semiconductor package
    封装键合用镀钯铜丝
    China National Standards
    semiconductor

    English PDF
    GB/T 5226.33-2017 Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment
    机械电气安全 机械电气设备 第33部分:半导体设备技术条件
    China National Standards
    semiconductor

    English PDF
    GB/T 34502-2017 Gold-coated silver and silver alloy bonding wires for semiconductor package
    封装键合用镀金银及银合金丝
    China National Standards
    semiconductor

    English PDF
    GB/T 15651.4-2017 semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers
    半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器
    China National Standards
    semiconductor

    English PDF
    GB/T 249-2017 The rule of type designation for discrete semiconductor devices
    半导体分立器件型号命名方法
    China National Standards
    semiconductor

    English PDF
    GB/T 14048.12-2016 Low-voltage switchgear and controlgear—Part 4-3: Contactors and motor-starters—AC semiconductor controllers and contactors for non-motor loads
    低压开关设备和控制设备 第4-3部分:接触器和电动机起动器 非电动机负载用交流半导体控制器和接触器
    China National Standards
    semiconductor

    English PDF
    GB/T 32817-2016 semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
    半导体器件 微机电器件 MEMS总规范
    China National Standards
    semiconductor

    English PDF
    GB/T 14048.6-2016 Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters)
    低压开关设备和控制设备 第4-2部分:接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器)
    China National Standards
    semiconductor

    English PDF
    GB/T 13539.4-2016 Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
    低压熔断器 第4部分:半导体设备保护用熔断体的补充要求
    China National Standards
    semiconductor

    English PDF
    GB/T 4023-2015 semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes
    半导体器件 分立器件和集成电路 第2部分:整流二极管
    China National Standards
    semiconductor

    English PDF
    GB/T 15291-2015 semiconductor devices—Part 6: Thyristors
    半导体器件 第6部分:晶闸管
    China National Standards
    semiconductor

    English PDF
    GB/T 31469-2015 semiconductor materials cutting fluid
    半导体材料切削液
    China National Standards
    semiconductor

    English PDF
    GB/T 16525-2015 semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
    半导体集成电路 塑料有引线片式载体封装引线框架规范
    China National Standards
    semiconductor

    English PDF
    GB/T 15878-2015 semiconductor integrated circuits—Specification of leadframes for small outline package
    半导体集成电路 小外形封装引线框架规范
    China National Standards
    semiconductor

    English PDF
    GB/T 15876-2015 semiconductor integrated circuits—Specification of leadframes for plastic quad flat package
    半导体集成电路 塑料四面引线扁平封装引线框架规范
    China National Standards
    semiconductor

    English PDF
    GB/T 14112-2015 semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
    半导体集成电路 塑料双列封装冲制型引线框架规范
    China National Standards
    semiconductor

    English PDF
    GB/T 31359-2015 Test methods of semiconductor lasers
    半导体激光器测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 31358-2015 General specification for semiconductor lasers
    半导体激光器总规范
    China National Standards
    semiconductor

    English PDF
    GB/T 8750-2014 Gold bonding wire for semiconductor package
    半导体封装用键合金丝
    China National Standards
    semiconductor

    English PDF
    GB/T 15877-2013 semiconductor integrated circuits—Specification of DIP leadframes produced by etching
    半导体集成电路 蚀刻型双列封装引线框架规范
    China National Standards
    semiconductor

    English PDF
    GB/T 15872-2013 Power supply interface for semiconductor equipment
    半导体设备电源接口
    China National Standards
    semiconductor

    English PDF
    GB/T 30116-2013 Requirements for semiconductor manufacturing facility electromagnetic compatibility
    半导体生产设施电磁兼容性要求
    China National Standards
    semiconductor

    English PDF
    GB/T 29845-2013 Guide for final assembly, packaging,transportation, unpacking, and relocation of semiconductor manufacturing equipment
    半导体制造设备的最终装配、包装、运输、拆包及安放导则
    China National Standards
    semiconductor

    English PDF
    GB/T 3859.3-2013 semiconductor converters - General requirements and line commutated converters - Part 1-3: Transformers and reactors
    半导体变流器 通用要求和电网换相变流器 第1-3部分:变压器和电抗器
    China National Standards
    semiconductor

    English PDF
    GB/T 3859.2-2013 semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide
    半导体变流器 通用要求和电网换相变流器 第1-2部分:应用导则
    China National Standards
    semiconductor

    English PDF
    GB/T 3859.1-2013 semiconductor converters - General requirements and line commutated Converters - Part 1-1: Specification of basic requirements
    半导体变流器 通用要求和电网换相变流器 第1-1部分:基本要求规范
    China National Standards
    semiconductor

    English PDF
    GB/T 13422-2013 semiconductor converters - Electrical test methods
    半导体变流器 电气试验方法
    China National Standards
    semiconductor

    English PDF
    GB/T 29332-2012 semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors(IGBT)
    半导体器件 分立器件 第9部分:绝缘栅双极晶体管(IGBT)
    China National Standards
    semiconductor

    English PDF
    GB/T 29299-2012 General specification of semiconductor laser rangefinder
    半导体激光测距仪通用技术条件
    China National Standards
    semiconductor

    English PDF
    GB/T 13973-2012 General specification test methods for semiconductor device curve tracers
    半导体管特性图示仪通用规范
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.4-2012 semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    半导体器件 机械和气候试验方法 第4部分:强加速稳态湿热试验(HAST)
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.3-2012 semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination
    半导体器件 机械和气候试验方法 第3部分:外部目检
    China National Standards
    semiconductor

    English PDF
    GB/T 5201-2012 Test procedures for semiconductor charged particle detectors
    带电粒子半导体探测器测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 12669-2012 General specification for cascade speed control assembly with semiconductor converter
    半导体变流串级调速装置总技术条件
    China National Standards
    semiconductor

    English PDF
    GB/T 12667-2012 General specification for excitation assembly with semiconductors for synchronous motors
    同步电动机半导体励磁装置总技术条件
    China National Standards
    semiconductor

    English PDF
    GB/T 26070-2010 Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method
    化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge
    半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法
    China National Standards
    semiconductor

    English PDF
    GB/T 1555-2009 Testing methods for determining the orientation of a semiconductor single crystal
    半导体单晶晶向测定方法
    China National Standards
    semiconductor

    English PDF
    GB/T 14264-2009 semiconductor materials-terms and definitions
    半导体材料术语
    China National Standards
    semiconductor

    English PDF
    GB/T 14140-2009 Test method for measuring diameter of semiconductor wafer
    硅片直径测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 24468-2009 Specification for definition and measurement of semiconductor equipment reliability, availability, and maintainability(RAM)
    半导体设备可靠性、可用性和维修性(RAM)的定义和测量规范
    China National Standards
    semiconductor

    English PDF
    GB/T 13539.4-2009 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
    低压熔断器 第4部分:半导体设备保护用熔断体的补充要求
    China National Standards
    semiconductor

    English PDF
    GB/T 22193-2008 Electrical installations in ships - Equipment - semiconductor convertors
    船舶电气设备 设备 半导体变流器
    China National Standards
    semiconductor

    English PDF
    GB/T 21548-2008 Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems
    光通信用高速直接调制半导体激光器的测量方法
    China National Standards
    semiconductor

    English PDF
    GB 14048.6-2008 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters AC semiconductor motor controllers and starters(including soft-starter)
    低压开关设备和控制设备 第4-2部分:接触器和电动机起动器 交流半导体电动机控制器和起动器(含软起动器)
    China National Standards
    semiconductor

    English PDF
    GB/T 21226-2007 semiconductor convertors - Identification code for convertor connections
    半导体变流器 变流联结的标识代号
    China National Standards
    semiconductor

    English PDF
    GB/T 21039.1-2007 semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification
    半导体器件 分立器件 第4-1部分:微波二极管和晶体管 微波场效应晶体管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 20870.1-2007 semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    半导体器件 第16-1部分:微波集成电路 放大器
    China National Standards
    semiconductor

    English PDF
    GB/T 20726-2006 Instrumental specification for energy dispersive X-ray spectrometers with semiconductor detectors
    半导体探测器X射线能谱仪通则
    China National Standards
    semiconductor

    English PDF
    GB/T 17574.9-2006 semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
    半导体器件 集成电路 第2-9部分:数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 17574.20-2006 semiconductor devices - Integrated circuits - Part 2-20:Digital integrated circuits - Family specification - Low voltage integrated circuits
    半导体器件 集成电路 第2-20部分:数字集成电路 低压集成电路族规范
    China National Standards
    semiconductor

    English PDF
    GB/T 17574.11-2006 semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
    半导体器件 集成电路 第2-11部分:数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 14048.12-2006 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters-AC semiconductor controllers and contactors for non-motor loads
    低压开关设备和控制设备 第4-3部分:接触器和电动机起动器-非电动机负载用交流半导体控制器和接触器
    China National Standards
    semiconductor

    English PDF
    GB/T 10236-2006 Guide for compatibility and protection of interference effects between semiconductor convertors and power supply system
    半导体变流器与供电系统的兼容及干扰防护导则
    China National Standards
    semiconductor

    English PDF
    GB/T 4589.1-2006 semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    半导体器件 第10部分:分立器件和集成电路总规范
    China National Standards
    semiconductor

    English PDF
    GB/T 20516-2006 semiconductor devices - Discrete devices - Part 4: Microwave devices
    半导体器件 分立器件 第4部分:微波器件
    China National Standards
    semiconductor

    English PDF
    GB/T 20515-2006 semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
    半导体器件 集成电路 第5部分:半定制集成电路
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.2-2006 semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure
    半导体器件 机械和气候试验方法 第2部分:低气压
    China National Standards
    semiconductor

    English PDF
    GB/T 4937.1-2006 semiconductor devices―Mechanical and climatic test methods―Part 1: General
    半导体器件 机械和气候试验方法 第1部分: 总则
    China National Standards
    semiconductor

    English PDF
    GB/T 20522-2006 semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
    半导体器件 第14-3部分: 半导体传感器-压力传感器
    China National Standards
    semiconductor

    English PDF
    GB/T 20521-2006 Semconductor devices Part 14-1: semiconductor sensors - General and classification
    半导体器件 第14-1部分: 半导体传感器-总则和分类
    China National Standards
    semiconductor

    English PDF
    GB/T 12750-2006 semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    半导体器件 集成电路 第11部分:半导体集成电路分规范(不包括混合电路)
    China National Standards
    semiconductor

    English PDF
    GB/T 4326-2006 Extrinsic semiconductor single crystals measurement of Hall mobility and Hall coefficient
    非本征半导体单晶霍尔迁移率和霍尔系数测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 13151-2005 semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A
    半导体器件 分立器件 第6部分:晶闸管 第3篇 电流大于 100A、环境和管壳额定的反向阻断三极晶闸管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 13150-2005 semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A
    半导体器件 分立器件 电流大于 100A、环境和管壳额定的双向三极晶闸管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 4728.5-2005 Graphical symbols for diagrams Part 5 semiconductors and electron tubes
    电气简图用图形符号 第5部分:半导体管和电子管
    China National Standards
    semiconductor

    English PDF
    GB/T 3859.4-2004 semiconductor converter--Self-commutated semiconductor converters including direct d.c.converters
    半导体变流器 包括直接直流变流器的半导体自换相变流器
    China National Standards
    semiconductor

    English PDF
    GB/T 2900.66-2004 Electrotechnical terminology--semiconductor devices and integrated circuits
    电工术语 半导体器件和集成电路
    China National Standards
    semiconductor

    English PDF
    GB/T 8446.3-2004 Heat sink for power semiconductor device--Part 3:Insulators and fasteners
    电力半导体器件用散热器 第3部分:绝缘件和紧固件
    China National Standards
    semiconductor

    English PDF
    GB/T 8446.2-2004 Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference
    电力半导体器件用散热器 第2部分:热阻和流阻测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 8446.1-2004 Heat sink for power semiconductor device--Part 1:Casting kind series
    电力半导体器件用散热器 第1部分:铸造类系列
    China National Standards
    semiconductor

    English PDF
    GB/T 19403.1-2003 semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
    半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路)
    China National Standards
    semiconductor

    English PDF
    GB/T 17574.10-2003 semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
    半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 15651.3-2003 Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods
    半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法
    China National Standards
    semiconductor

    English PDF
    GB/T 15651.2-2003 Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics
    半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性
    China National Standards
    semiconductor

    English PDF
    GB/T 11685-2003 Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energyspectrometers
    半导体X射线探测器系统和半导体X射线能谱仪的测量方法
    China National Standards
    semiconductor

    English PDF
    GB/T 18904.5-2003 semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail,for fibre optic systems or subsystems
    半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6589-2002 semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)
    半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 18904.4-2002 semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems
    半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 18904.3-2002 semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application
    半导体器件 第12-3部分:光电子器件 显示用发光二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 18904.2-2002 semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems
    半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 18904.1-2002 semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems
    半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 18500.2-2001 semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
    半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 18500.1-2001 semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
    半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 11499-2001 Letter symbols for discrete semiconductor devices
    半导体分立器件文字符号
    China National Standards
    semiconductor

    English PDF
    GB/T 6588-2000 semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes,switching diodes and controlled-avalanche diodes
    半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 17950-2000 semiconductor converter--Part 6:Application guide for the protection of semiconductor converters against overcurrent by fuses
    半导体变流器 第6部分:使用熔断器保护半导体变流器防止过电流的应用导则
    China National Standards
    semiconductor

    English PDF
    GB/T 5965-2000 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
    半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 17940-2000 semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
    半导体器件 集成电路 第3部分:模拟集成电路
    China National Standards
    semiconductor

    English PDF
    GB/T 12560-1999 semiconductor devices--Sectional specification for discrete devices
    半导体器件 分立器件分规范
    China National Standards
    semiconductor

    English PDF
    GB/T 9424-1998 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits,series 4000B and 4000UB
    半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 7576-1998 semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification
    半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6590-1998 semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs),ambient or case-rated,up to 100A
    半导体器件 分立器件 第6部分:闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6352-1998 semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors,ambient or case-rated,up to 100A
    半导体器件 分立器件 第6部分:闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6351-1998 semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes),ambient and case-rated,up to 100A
    半导体器件 分立器件 第2部分:整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6219-1998 semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz
    半导体器件 分立器件 第8部分:场效应晶体管 第一篇 1 GHz、5 W以下的单栅场效应晶体管 空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6217-1998 semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section One:Blank detail speci-fication for ambient-rated bipolar transistors for low and high frequency amplification
    半导体器件 分立器件 第7部分:双极型晶体管 第一篇 高低频放大环境额定的双极型晶体管空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 17574-1998 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits
    半导体器件 集成电路 第2部分:数字集成电路
    China National Standards
    semiconductor

    English PDF
    GB/T 17573-1998 semiconductor devices--Discrete devices and integrated circuits--Part 1:General
    半导体器件 分立器件和集成电路 第1部分:总则
    China National Standards
    semiconductor

    English PDF
    GB/T 17572-1998 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits,series 4000B and 4000UB
    半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范
    China National Standards
    semiconductor

    English PDF
    GB/T 4023-1997 semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes
    半导体器件 分立器件和集成电路 第2部分:整流二极管
    China National Standards
    semiconductor

    English PDF
    GB/T 17024-1997 semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
    半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范
    China National Standards
    semiconductor

    English PDF
    GB/T 17023-1997 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
    半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范
    China National Standards
    semiconductor

    English PDF
    GB/T 6798-1996 semiconductor integrated circuits--General principles of measuring methods of voltage comparators
    半导体集成电路 电压比较器测试方法的基本原理
    China National Standards
    semiconductor

    English PDF
    GB/T 4377-1996 semiconductor integrated circuits--General principles of measuring methods of voltage regulator
    半导体集成电路 电压调整器测试方法的基本原理
    China National Standards
    semiconductor

    English PDF
    GB/T 3436-1996 semiconductor integrated circuits--Series and products of operational amplifier
    半导体集成电路 运算放大器系列和品种
    China National Standards
    semiconductor

    English PDF
    GB/T 16464-1996 semiconductor devices--Integrated circuits--Part 1:General
    半导体器件 集成电路 第1部分:总则
    China National Standards
    semiconductor

    English PDF

    Find out:240Items   |  To Page of: First -Previous-Next -Last  | 1 2

     

    +86-755-25831330        sales@gbstandards.org 
    106# Zhongmao Mansion,No.1 Beizhan Road,Shenzhen,China
    ©  RJS Copyright  2001-2024 All Rights Reserved

    - Since 2001 -
    Focus on China Standards & Compliance Services

    www.rjs.cn

    China Licenses

    www.transcustoms.com

    China HS code & Tariff

    www.gbstandards.org

    China National Standards