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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| SJ/T 11391-2019 |
Tin alloy powder for soldering electronic products {译} 电子产品焊接用锡合金粉 |
China Electronics Industry
Standards soldering |
 English PDF |
| SJ/T 11389-2019 |
Flux for lead-free soldering {译} 无铅焊接用助焊剂 |
China Electronics Industry
Standards soldering |
English PDF |
| SJ/T 11200-2016 |
(Environmental testing Part 2-58: Tests - Test Td: surface mount components solderability, dissolution of metallization layers and resistance to soldering heat resistance test method) 环境试验 2-58部分：试验 试验td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 11391-2009 |
Solder powder for electronic soldering applications 电子产品焊接用锡合金粉 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 11389-2009 |
Fluxes for lead-free soldering application 无铅焊接用助焊剂 |
China Electronics
Standards soldering |
English PDF |
| SJ 20882-2003 |
Requirement for soldering technology of PCB assembles 印制电路组件装焊工艺要求 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 11216-1999 |
Technology requirement for infrared for air reflow soldering 红外／热风再流焊接技术要求 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 11168-1998 |
Solder wire for soldering cleanout-free 免清洗焊接用焊锡丝 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 10667-1995 |
symbol and notation for brazing, soldering and sealing 钎焊、封接的代号及标注方法 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 10534-1994 |
Requirements for wave soldering 波峰焊接技术要求 |
China Electronics
Standards soldering |
English PDF |
| SJ/T 31250-1994 |
Requirements of readiness and methods of inspection and assessment for automatic potentiometer soldering lug riveting machines 电位器焊片铆接自动机完好要求和检查评定方法 |
China Electronics
Standards soldering |
English PDF |
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