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GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards; We provide Chinese GB standards and English version GB standards Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services. |
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43755-2024 |
Preformed solder 预成形软钎料 |
China National Standards solder |
 English PDF |
| GB/T 15651.7-2024 |
Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管 |
China National Standards solder |
English PDF |
| GB/Z 41275.23-2023 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分：无铅及混装电子产品返工/修复指南 |
China National Standards solder |
English PDF |
| GB/Z 41275.22-2023 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solders Part 22: Technical Guide 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第22部分：技术指南 |
China National Standards solder |
English PDF |
| GB/Z 41275.4-2023 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solder Part 4: Ball Grid Array Ball Installation 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球 |
China National Standards solder |
English PDF |
| GB/T 17473.7-2022 |
Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance 微电子技术用贵金属浆料测试方法 第7部分：可焊性、耐焊性测定 |
China National Standards solder |
English PDF |
| GB/T 41275.3-2022 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solder Part 3: System Performance Test Methods Containing Lead-Free Solder and Lead-Free Pins 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分：含无铅焊料和无铅管脚的系统性能试验方法 |
China National Standards solder |
English PDF |
| GB/T 41275.21-2022 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solders Part 21: Guidelines for Transitioning to Lead-Free Electronics 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第21部分：向无铅电子过渡指南 |
China National Standards solder |
English PDF |
| GB/T 41275.2-2022 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solders Part 2: Reducing the Harmful Effects of Tin 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第2部分：减少锡有害影响 |
China National Standards solder |
English PDF |
| GB/T 38265.3-2022 |
Test methods for soldering fluxes - Part 3: Determination of acid value - Potentiometric and visual titration 软钎剂试验方法 第3部分：酸值的测定 电位滴定法和目视滴定法 |
China National Standards solder |
English PDF |
| GB/T 38265.17-2022 |
soldering flux test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test for flux residues 软钎剂试验方法 第17部分：钎剂残留物的表面绝缘电阻梳刷试验和电化学迁移试验 |
China National Standards solder |
English PDF |
| GB/T 38265.9-2022 |
Test methods for soldering fluxes - Part 9: Determination of ammonia content 软钎剂试验方法 第9部分：氨含量的测定 |
China National Standards solder |
English PDF |
| GB/T 38265.8-2022 |
Test methods for soldering fluxes - Part 8: Determination of zinc content 软钎剂试验方法 第8部分：锌含量的测定 |
China National Standards solder |
English PDF |
| GB/T 38265.6-2022 |
Test methods for soldering fluxes - Part 6: Determination of halide (excluding fluoride) content 软钎剂试验方法 第6部分：卤化物（不包括氟化物）含量的测定 |
China National Standards solder |
English PDF |
| GB/T 15829-2021 |
Soft soldering flux -- Classification and requirements 软钎剂 分类与性能要求 |
China National Standards solder |
English PDF |
| GB/T 41104.3-2021 |
solder wire, solid and flux cored -- Specifications and test methods -- Part 3: Wetting balance test method for flux cored solder wire efficacy 实心和药芯软钎料丝? 规范和试验方法? 第3部分：药芯软钎料丝功效的润湿平衡试验方法 |
China National Standards solder |
English PDF |
| GB/T 41104.2-2021 |
solder wire, solid and flux cored -- Specification and test methods -- Part 2: Determination of flux content 实心和药芯软钎料丝? 规范和试验方法? 第2部分：钎剂含量的测定 |
China National Standards solder |
English PDF |
| GB/T 41104.1-2021 |
solder wire, solid and flux cored -- Specification and test methods -- Part 1: Classification and performance requirements 实心和药芯软钎料丝? 规范和试验方法? 第1部分：分类和性能要求 |
China National Standards solder |
English PDF |
| GB/T 38265.15-2021 |
Test methods for soft soldering fluxes—Part 15: Copper corrosion test 软钎剂试验方法 第15部分：铜腐蚀试验 |
China National Standards solder |
English PDF |
| GB/T 38265.14-2021 |
Test methods for soft soldering fluxes—Part 14: Assessment of tackiness of flux residues 软钎剂试验方法 第14部分：钎剂残留物胶粘性的评价 |
China National Standards solder |
English PDF |
| GB/T 38265.13-2021 |
Test methods for soft soldering fluxes—Part 13: Determination of flux spattering 软钎剂试验方法 第13部分：钎剂溅散性的测定 |
China National Standards solder |
English PDF |
| GB/T 38265.11-2021 |
Test methods for soft soldering fluxes—Part 11: Solubility of flux residues 软钎剂试验方法 第11部分：钎剂残留物的可溶性 |
China National Standards solder |
English PDF |
| GB/T 38265.5-2021 |
Test methods for soft soldering fluxes -- Part 5: Copper mirror test 软钎剂试验方法 第5部分：铜镜试验 |
China National Standards solder |
English PDF |
| GB/T 9491-2021 |
Flux for tin soldering 锡焊用助焊剂 |
China National Standards solder |
English PDF |
| GB/T 3131-2020 |
Tin-lead solder 锡铅钎料 |
China National Standards solder |
English PDF |
| GB/T 38265.2-2019 |
Test methods for soft soldering fluxes—Part 2: Determination of non-volatile matter—Ebulliometric method 软钎剂试验方法 第2部分：不挥发物质含量的测定 沸点法 |
China National Standards solder |
English PDF |
| GB/T 38265.1-2019 |
Test methods for soft soldering fluxes—Part 1:Determination of non-volatile matter—Gravimetric method 软钎剂试验方法 第1部分：不挥发物质含量的测定 重量法 |
China National Standards solder |
English PDF |
| GB/T 38265.16-2019 |
Test methods for soft soldering fluxes—Part 16:Flux efficacy test—Wetting balance method 软钎剂试验方法 第16部分：软钎剂润湿性能 润湿平衡法 |
China National Standards solder |
English PDF |
| GB/T 38265.10-2019 |
Test methods for soft soldering fluxes—Part 10:Flux efficacy test—Solder spread method 软钎剂试验方法 第10部分：软钎剂润湿性能 铺展试验方法 |
China National Standards solder |
English PDF |
| GB/T 38265.1-2019 |
Test methods for soft soldering fluxes—Part 1:Determination of non-volatile matter—Gravimetric method 软钎剂试验方法 第1部分：不挥发物质含量的测定 重量法 |
China National Standards solder |
English PDF |
| GB/T 20422-2018 |
Lead-free solders 无铅钎料 |
China National Standards solder |
English PDF |
| GB/T 4937.21-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 21: solderability 半导体器件 机械和气候试验方法 第21部分：可焊性 |
China National Standards solder |
English PDF |
| GB/T 4937.201-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards solder |
English PDF |
| GB/T 4937.20-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards solder |
English PDF |
| GB/T 4937.15-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热 |
China National Standards solder |
English PDF |
| GB/T 10574.10-2017 |
Methods for chemical analysis of tin-lead solders—Part 10：Determination of cadmium content—Flame atomic absorption spectrometry and Na2EDTA titration method 锡铅焊料化学分析方法 第10部分：镉量的测定 火焰原子吸收光谱法和Na2EDTA滴定法 |
China National Standards solder |
English PDF |
| GB/T 10574.13-2017 |
Methods for chemical analysis of tin-lead solders—Part 13：Determination of antimony,bismuth,iron,arsenic,copper,silver,zinc,aluminium,cadmium,phosphorous and gold contents—Inductively coupled plasma atomic emission spectrometric method 锡铅焊料化学分析方法 第13部分：锑、铋、铁、砷、铜、银、锌、铝、镉、磷和金量的测定 电感耦合等离子体原子发射光谱法 |
China National Standards solder |
English PDF |
| GB/T 10574.9-2017 |
Methods for chemical analysis of tin-lead solders—Part 9：Determination of aluminium content—Graphite furnace atomic absorption spectrometric method 锡铅焊料化学分析方法 第9部分：铝量的测定 电热原子吸收光谱法 |
China National Standards solder |
English PDF |
| GB/T 10574.7-2017 |
Methods for chemical analysis of tin-lead solders—Part 7：Determination of silver content—Flame atomic absorption spectrometry and potassium thiocyanate potentiometric titration 锡铅焊料化学分析方法 第7部分：银量的测定 火焰原子吸收光谱法和硫氰酸钾电位滴定法 |
China National Standards solder |
English PDF |
| GB/T 10574.12-2017 |
Methods for chemical analysis of tin-lead solders—Part 12：Determination of sulfur content—High frequency combustion with infrared absorption method 锡铅焊料化学分析方法 第12部分：硫量的测定 高频燃烧红外吸收光谱法 |
China National Standards solder |
English PDF |
| GB/T 10574.14-2017 |
Methods for chemical analysis of tin-lead solders—Part 14：Determination of tin, lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry 锡铅焊料化学分析方法 第14部分：锡、铅、锑、铋、银、铜、锌、镉和砷量的测定 光电发射光谱法 |
China National Standards solder |
English PDF |
| GB/T 10574.11-2017 |
Methods for chemical analysis of tin-lead solders—Part 11：Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry 锡铅焊料化学分析方法 第11部分：磷量的测定 结晶紫-磷钒钼杂多酸分光光度法 |
China National Standards solder |
English PDF |
| GB/T 10574.8-2017 |
Methods for chemical analysis of tin-lead solders—Part 8：Determination of zinc content—Flame atomic absorption spectrometric method 锡铅焊料化学分析方法 第8部分：锌量的测定 火焰原子吸收光谱法 |
China National Standards solder |
English PDF |
| GB/T 33148-2016 |
soldering and brazing terms 钎焊术语 |
China National Standards solder |
English PDF |
| GB/T 18290.5-2015 |
solderless connections—Part 5: Press-in connections—General requirements, test methods and practical guidance 无焊连接 第5部分：压入式连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 18290.4-2015 |
solderless connections— Part 4: Solderless non-accessible insulation displacement connections— General requirements, test methods and practical guidance 无焊连接 第4部分：不可接触无焊绝缘位移连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 18290.2-2015 |
solderless connections— Part 2：Crimped connections—General requirements,test methods and practical guidance 无焊连接 第2部分：压接连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 31476-2015 |
Requirements for solders for high-quality interconnections in electronics assembly 电子装联高质量内部互连用焊料 |
China National Standards solder |
English PDF |
| GB/T 31475-2015 |
Requirements for solder paste for high-quality interconnections in electronics assembly 电子装联高质量内部互连用焊锡膏 |
China National Standards solder |
English PDF |
| GB/T 31474-2015 |
soldering fluxes for high-quality interconnections in electronics assembly 电子装联高质量内部互连用助焊剂 |
China National Standards solder |
English PDF |
| GB/T 8012-2013 |
Casting tin-lead solders 铸造锡铅焊料 |
China National Standards solder |
English PDF |
| GB/T 29089-2012 |
Spherical tin-solder powder 球形焊锡粉 |
China National Standards solder |
English PDF |
| GB/T 28770-2012 |
Test methods for solders 软钎料试验方法 |
China National Standards solder |
English PDF |
| GB/T 4909.12-2009 |
Test methods for bare wires - Part 12: solderability test of coating - Solder globule method 裸电线试验方法 第12部分：镀层可焊性试验-焊球法 |
China National Standards solder |
English PDF |
| GB/T 2424.17-2008 |
Environmental testing - Part 2: Tests methods guidance on - Test T: soldering Test 电工电子产品环境试验 第2部分：试验方法 试验T：锡焊试验导则 |
China National Standards solder |
English PDF |
| GB/T 11018.2-2008 |
Copper winding wires with silk covering - Part 2: Bunched solderable polyurethane enamelled round copper wires, class130, with silk covering 丝包铜绕组线 第2部分：130级丝包直焊聚氨酯漆包束线 |
China National Standards solder |
English PDF |
| GB/T 7157-2008 |
Electric soldering irons 电烙铁 |
China National Standards solder |
English PDF |
| GB/T 15829-2008 |
Soft soldering flux - Classification and requirements 软钎剂 分类与性能要求 |
China National Standards solder |
English PDF |
| GB/T 11363-2008 |
Test method of the strength for brazed and soldered joint 钎焊接头强度试验方法 |
China National Standards solder |
English PDF |
| GB/T 6109.9-2008 |
Enamelled round winding wire - Part 9:solderable polyurethane enamelled round copper wire overcoated with polyamide,class 130 漆包圆绕组线 第9部分：130级聚酰胺复合直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.4-2008 |
Enamelled round winding wire - Part 4:solderable polyurethane enamelled round copper wire,class 130 漆包圆绕组线 第4部分：130级直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.23-2008 |
Enamelled round winding wire - Part 23: solderable polyurethane enamelled round copper wire,class 180 漆包圆绕组线 第23部分：180级直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.17-2008 |
Enamelled round winding wire - Part 17: solderable polyesterimide enamelled round copper wire,class 180,with a bonding layer 漆包圆绕组线 第17部分：180级自粘性直焊聚酯亚胺漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.16-2008 |
Enamelled round winding wire - Part 16: solderable polyurethane enamelled round copper wire,class 155,with a bonding layer 漆包圆绕组线 第16部分：155级自粘性直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.15-2008 |
Enamelled round winding wire - Part 15:solderable polyurethane enamelled round copper wire,class 130,with a bonding layer 漆包圆绕组线 第15部分：130级自粘性直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.13-2008 |
Enamelled round winding wire - Part 13: solderable polyesterimide enamelled round copper wire,class 180 漆包圆绕组线 第13部分：180级直焊聚酯亚胺漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.11-2008 |
Enamelled round winding wire - Part 11: solderable polyurethane enamelled round copper wire overcoated with polyamide,class 155 漆包圆绕组线 第11部分：155级聚酰胺复合直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 6109.10-2008 |
Enamelled round winding wire - Part 10: solderable polyurethane enamelled round copper wire,class 155 漆包圆绕组线 第10部分：155级直焊聚氨酯漆包铜圆线 |
China National Standards solder |
English PDF |
| GB/T 17473.7-2008 |
Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance 微电子技术用贵金属浆料测试方法 可焊性、耐焊性测定 |
China National Standards solder |
English PDF |
| GB/T 2423.32-2008 |
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: solderability test by the wetting balance method 电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性 |
China National Standards solder |
English PDF |
| GB/T 20422-2006 |
Lead-free solders 无铅钎料 |
China National Standards solder |
English PDF |
| GB/T 2423.28-2005 |
Basic environmental testing procedures for electric and electronic products-Part2:Test methods-Test T:soldering 电工电子产品环境试验 第2部分：试验方法 试验T：锡焊 |
China National Standards solder |
English PDF |
| GB/T 19247.4-2003 |
Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies 印制板组装 第4部分:分规范 引出端焊接组装的要求 |
China National Standards solder |
English PDF |
| GB/T 19247.3-2003 |
Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies 印制板组装 第3部分:分规范 通孔安装焊接组装的要求 |
China National Standards solder |
English PDF |
| GB/T 19247.2-2003 |
Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies 印制板组装 第2部分: 分规范 表面安装焊接组装的要求 |
China National Standards solder |
English PDF |
| GB/T 19247.1-2003 |
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求 |
China National Standards solder |
English PDF |
| GB/T 10574.9-2003 |
Methods for chemical analysis of tin-lead solders--Determination of aluminum content 锡铅焊料化学分析方法 铝量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.8-2003 |
Methods for chemical analysis of tin-lead solders--Determination of zinc content 锡铅焊料化学分析方法 锌量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.7-2003 |
Methods for chemical analysis of tin-lead solders--Determination of silver content 锡铅焊料化学分析方法 银量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.6-2003 |
Methods for chemical analysis of tin-lead solders--Determination of copper content 锡铅焊料化学分析方法 铜量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.5-2003 |
Methods for chemical analysis of tin-lead solders--Determination of arsenic content 锡铅焊料化学分析方法 砷量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.4-2003 |
Methods for chemical analysis of tin-lead solders--Determination of iron content 锡铅焊料化学分析方法 铁量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.3-2003 |
Methods for chemical analysis of tin-lead solders--Determination of bismuth content 锡铅焊料化学分析方法 铋量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.2-2003 |
Methods for chemical analysis of tin-lead solders--Determination of antimony content 锡铅焊料化学分析方法 锑量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.13-2003 |
Methods for chemical analysis of tin-lead solders--Determination of copper，iron，cadmium，silver，gold，arsenic，zinc，aluminium，bismuth，phosphorous content 锡铅焊料化学分析方法 铜、铁、镉、银、金、砷、锌、铝、铋、磷量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.12-2003 |
Methods for chemical analysis of tin-lead solders--Determination of sulphur content 锡铅焊料化学分析方法 硫量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.1-2003 |
Methods for chemical analysis of tin-lead solders--Determination of tin content 锡铅焊料化学分析方法 锡量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.11-2003 |
Methods for chemical analysis of tin-lead solders--Determination of phosphorus content 锡铅焊料化学分析方法 磷量的测定 |
China National Standards solder |
English PDF |
| GB/T 10574.10-2003 |
Methods for chemical analysis of tin-lead solders--Determination of cadmium content 锡铅焊料化学分析方法 镉量的测定 |
China National Standards solder |
English PDF |
| GB/T 9491-2002 |
Liquid flux for soldering(Rosin base) 锡焊用液态焊剂(松香基) |
China National Standards solder |
English PDF |
| GB/T 3131-2001 |
Tin-lead solder 锡铅钎料 |
China National Standards solder |
English PDF |
| GB/T 18290.5-2000 |
solderless connections--Part 5:Solderless press-in connections--General requirements，test methods and practical guidance 无焊连接 第5部分:无焊压入式连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 18290.4-2000 |
solderless connections--Part 4:Solderless non-accessible insulation displacement connections--General requirements，test methods and practical guidance 无焊连接 第4部分:不可接触无焊绝缘位移连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 18290.3-2000 |
solderless connections--Part 3:Solderless accessible insulation displacement connections--General requirements，test methods and practical guidance 无焊连接 第3部分:可接触无焊绝缘位移连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 18290.2-2000 |
solderless connections--Part 2:Solderless crimped connections--General requirements， test methods and practical guidance 无焊连接 第2部分:无焊压接连接 一般要求、试验方法和使用导则 |
China National Standards solder |
English PDF |
| GB/T 5095.6-1997 |
Electromechanical components for electronic equipment--Basic testing proceduresand measuring methods--Part 6:Climatic tests and soldering tests 电子设备用机电元件 基本试验规程及测量方法 第6部分:气候试验和锡焊试验 |
China National Standards solder |
English PDF |
| GB/T 5095.12-1997 |
Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 12:soldering tests--Section 6:Test 12f--Sealing against flux and cleaning solvents inmachine soldering 电子设备用机电元件 基本试验规程及测量方法 第12部分:锡焊试验 第六篇:试验12f在机器焊接中封焊处耐焊剂和清洁剂 |
China National Standards solder |
English PDF |
| GB/T 16745-1997 |
Standard test method for solderability of metallic-coated products 金属覆盖层产品钎焊性的标准试验方法 |
China National Standards solder |
English PDF |
| GB/T 7157-2019 |
Electric soldering irons and heating guns 电烙铁和热风枪 |
China National Standards solder |
English PDF |
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